中英互译
flip chip
美 /flɪp tʃɪp/
基本释义
- 翻转芯片：一种将半导体器件与外部电路互连的方法，通过在芯片焊盘上沉积焊料球来实现。
双语例句
- The process of flip chip based on aluminum nitride is studied.研究了以氮化铝为基板的倒扣封装的工艺。
- The embedded active chip also can be realized by backside thinning and flip chip bonding.通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
- Flip chip technology has become one of the major joining technologies in electronic packaging.摘要覆晶技术已成为电子构装中之主要接合技术之一。
网络短语
- flip chip bonder倒装焊接机；倒装片接合机；设备；覆晶固晶机
- flip chip bonding倒装焊接；侧装片接合；倒装焊
- flip chip bump倒装芯片隆起焊盘；倒装片凸点
- flip-chip bonding倒装芯片安装；倒装晶片安装
- flip chip carrier倒装芯片座
英英释义
- Flip-Chip modules were used in the DEC PDP-7 (referred to in documentation as the "FLIP CHIP"), PDP-8, PDP-9 and PDP-10, beginning on August 24, 1964. The trademark "Flip-Chip"' was filed on August 27, 1964.