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dicing saw

美 /ˈdaɪsɪŋ sɔː/
  • 切片锯：一种使用高速主轴配备极薄的金刚石刀片或金刚线来切割、切割或切割半导体晶片、玻璃、陶瓷、水晶和许多其他类型材料的锯。

双语例句

  1. The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
    从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
  2. The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
    主要阐述了HP - 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。

网络短语

  • wafer dicing saw
    切片锯；转让划片机
  • substrate dicing saw
    衬底切割锯
  • dicing saw network management
    切割锯刀网路管理；切割
  • dicing saw wafer scriber
    划片机
  • IC Dicing saw
    主要市场

同义词

cutter barcutting machine
切割机，切割锯；钻石轮划片机

英英释义

  • A dicing saw is a kind of saw which employs a high-speed spindle fitted with an extremely thin diamond blade or diamond wire to dice, cut, or groove semiconductor wafers, silicon, glass, ceramic, crystal, and many other types of material.